Radiometry, the ability to take the temperature of every pixel, as well as both mobile industry processor interface (MIPI) and complementary metal-oxide semiconductor (CMOS) interfaces are now also available on all resolutions.
With these updates and a thermal sensitivity of 20 millikelvin (mK) or less, Boson+ is suitable for integration in unmanned ground vehicles, unmanned aircraft systems, automotive, wearables, security applications, handhelds, and thermal sights.
Dan Walker, vice president, product management, OEM cores at Teledyne Flir, said: “Boson+ is in volume manufacturing and is a drop-in upgrade for systems designed with Boson, making upgrades low risk and plug-and-play simple. With customer-selectable USB, CMOS, or MIPI video interfaces, it is now easier than ever to integrate Boson+ with a wide range of embedded processors from Qualcomm, Ambarella, and more.”
Made in the USA, the Boson+ features 640 x 512 and now 320 x 256 resolutions utilising the 12-micron pixel pitch thermal detector within a size, weight, and power optimised package. The noise equivalent differential temperature of 20 mK or less offers enhanced detection, recognition, and identification performance, especially in low-contrast and low-visibility environments. With improved automatic gain control and video latency compared to previous iterations of Boson, the Boson+ is said to deliver enhanced scene contrast and sharpness while improving tracking, seeker performance, and decision support.
Boson+ customers gain access to the US-based Teledyne Flir technical services team for integration support. Designed for integrators, the Boson+ is available with a variety of lens options, product documentation, a software development kit, and a user-friendly GUI.